An Introduction to Electronics Systems Packaging


Lecture 1 - Introduction and Objectives of the course


Lecture 2 - Definition of a system and history of semiconductors


Lecture 3 - Products and levels of packaging


Lecture 4 - Packaging aspects of handheld products; Case studies in applications


Lecture 5 - Case Study (continued); Definition of PWB, summary and Questions for review


Lecture 6 - Basics of Semiconductor and Process flowchart; Video on “Sand-to-Silicon”


Lecture 7 - Wafer fabrication, inspection and testing


Lecture 8 - Wafer packaging; Packaging evolution; Chip connection choices


Lecture 9 - Wire bonding, TAB and flipchip-1


Lecture 10 - Wire bonding, TAB and flipchip-2; Tutorials


Lecture 11 - Why packaging? & Single chip packages or modules (SCM)


Lecture 12 - Commonly used packages and advanced packages; Materials in packages


Lecture 13 - Advances packages (continued); Thermal mismatch in packages; Current trends in packaging


Lecture 14 - Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages


Lecture 15 - Electrical Issues – I; Resistive Parasitic


Lecture 16 - Electrical Issues – II; Capacitive and Inductive Parasitic


Lecture 17 - Electrical Issues – III; Layout guidelines and the Reflection problem


Lecture 18 - Electrical Issues – IV; Interconnection


Lecture 19 - Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT


Lecture 20 - Components of a CAD package and its highlights


Lecture 21 - Design Flow considerations; Beginning a circuit design with schematic work and component layout


Lecture 22 - Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability


Lecture 23 - Review of CAD output files for PCB fabrication; Photo plotting and mask generation


Lecture 24 - Process flow-chart; Vias; PWB substrates


Lecture 25 - Substrates continued; Video highlights; Surface preparation


Lecture 26 - Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs


Lecture 27 - PWB etching; Resist stripping; Screen-printing technology


Lecture 28 - Through-hole manufacture process steps; Panel and pattern plating methods


Lecture 29 - Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias


Lecture 30 - Microvia technology and Sequential build-up technology process flow for high-density interconnects


Lecture 31 - Conventional Vs HDI technologies; Flexible circuits; Tutorial session


Lecture 32 - SMD benefits; Design issues; Introduction to soldering


Lecture 33 - Reflow and Wave Soldering methods to attach SMDs


Lecture 34 - Solders; Wetting of solders; Flux and its properties; Defects in wave soldering


Lecture 35 - Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures


Lecture 36 - SMT failure library and Tin Whiskers


Lecture 37 - Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys


Lecture 38 - Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues


Lecture 39 - Thermal Design considerations in systems packaging


Lecture 40 - Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes


Lecture 41 - Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging


Lecture 42 - Chapter-wise summary