An Introduction to Electronics Systems Packaging

Lecture 1 - Introduction and Objectives of the course

Lecture 2 - Definition of a system and history of semiconductors

Lecture 3 - Products and levels of packaging

Lecture 4 - Packaging aspects of handheld products; Case studies in applications

Lecture 5 - Case Study (continued); Definition of PWB, summary and Questions for review

Lecture 6 - Basics of Semiconductor and Process flowchart; Video on “Sand-to-Silicon”

Lecture 7 - Wafer fabrication, inspection and testing

Lecture 8 - Wafer packaging; Packaging evolution; Chip connection choices

Lecture 9 - Wire bonding, TAB and flipchip-1

Lecture 10 - Wire bonding, TAB and flipchip-2; Tutorials

Lecture 11 - Why packaging? & Single chip packages or modules (SCM)

Lecture 12 - Commonly used packages and advanced packages; Materials in packages

Lecture 13 - Advances packages (continued); Thermal mismatch in packages; Current trends in packaging

Lecture 14 - Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages

Lecture 15 - Electrical Issues – I; Resistive Parasitic

Lecture 16 - Electrical Issues – II; Capacitive and Inductive Parasitic

Lecture 17 - Electrical Issues – III; Layout guidelines and the Reflection problem

Lecture 18 - Electrical Issues – IV; Interconnection

Lecture 19 - Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT

Lecture 20 - Components of a CAD package and its highlights

Lecture 21 - Design Flow considerations; Beginning a circuit design with schematic work and component layout

Lecture 22 - Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability

Lecture 23 - Review of CAD output files for PCB fabrication; Photo plotting and mask generation

Lecture 24 - Process flow-chart; Vias; PWB substrates

Lecture 25 - Substrates continued; Video highlights; Surface preparation

Lecture 26 - Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs

Lecture 27 - PWB etching; Resist stripping; Screen-printing technology

Lecture 28 - Through-hole manufacture process steps; Panel and pattern plating methods

Lecture 29 - Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias

Lecture 30 - Microvia technology and Sequential build-up technology process flow for high-density interconnects

Lecture 31 - Conventional Vs HDI technologies; Flexible circuits; Tutorial session

Lecture 32 - SMD benefits; Design issues; Introduction to soldering

Lecture 33 - Reflow and Wave Soldering methods to attach SMDs

Lecture 34 - Solders; Wetting of solders; Flux and its properties; Defects in wave soldering

Lecture 35 - Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures

Lecture 36 - SMT failure library and Tin Whiskers

Lecture 37 - Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys

Lecture 38 - Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues

Lecture 39 - Thermal Design considerations in systems packaging

Lecture 40 - Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes

Lecture 41 - Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging

Lecture 42 - Chapter-wise summary