NOC:Electronic Packaging and Manufacturing

Lecture 1 - Introduction - 1

Lecture 2 - Introduction - 2

Lecture 3 - Introduction - 3

Lecture 4 - Semiconductors and Components - 1

Lecture 5 - Semiconductors and Components - 2

Lecture 6 - 1st Level Packaging - I

Lecture 7 - 1st Level Packaging - II

Lecture 8 - Area Array Packages - I

Lecture 9 - Area Array Packages - II

Lecture 10 - Area Array Packages - III

Lecture 11 - Flip Chip Technology

Lecture 12 - 1st Level Interconnections - I

Lecture 13 - 1st Level Interconnections - II

Lecture 14 - 1st Level Interconnections - III

Lecture 15 - Advanced Packaging

Lecture 16 - 2nd Level Packaging: PCB - I

Lecture 17 - 2nd Level Packaging: PCB - II

Lecture 18 - 2nd Level Packaging: PCB - III

Lecture 19 - 2nd Level Packaging: PCB - IV

Lecture 20 - 2nd Level Packaging: PCB - V

Lecture 21 - System Integration

Lecture 22 - Thermal Management 1: Introduction

Lecture 23 - Thermal Management 2: Concepts

Lecture 24 - Thermal Management 3: Thermal Resistance

Lecture 25 - Thermal Management 4: Heat Sink

Lecture 26 - Thermal Management 5: Heat Sink Characterization

Lecture 27 - Thermal Management 6: Heat Transfer Correlations

Lecture 28 - Thermal Management 7: Practice Problems

Lecture 29 - Thermal Management 8: Thermal Technologies

Lecture 30 - Thermal Management 9: Novel Cooling Technologies

Lecture 31 - Shock and Vibration - 1

Lecture 32 - Shock and Vibration - 2

Lecture 33 - Shock and Vibration - 3

Lecture 34 - Shock and Vibration - 4

Lecture 35 - Electronic Packaging Reliability - 1

Lecture 36 - Electronic Packaging Reliability - 2

Lecture 37 - Electronic Packaging Reliability - 3

Lecture 38 - Electronic Packaging Reliability - 4

Lecture 39 - Power Electronics Packaging

Lecture 40 - Special Topics