Micro and Smart Systems


Lecture 1 - Glimpses of Microsystems: Scaling Effects


Lecture 2 - Smart Materials and Systems


Lecture 3 - Microsensors


Lecture 4 - Microactuators


Lecture 5 - Microsystems: some Examples


Lecture 6 - Smart systems Application and Structural Health Monitoring


Lecture 7 - Microfabrication Technologies


Lecture 8 - Thin-film Materials and their Deposition


Lecture 9 - Approaches for Pattern Transfer


Lecture 10 - Surface Micromachining of Microstructures


Lecture 11 - Bulk Micromachining of Microsystems


Lecture 12 - Extended Approaches for Working Microsystems


Lecture 13 - Non-conventional Approaches for Microsystems


Lecture 14 - Packaging of Microsystems


Lecture 15 - Deformation Strains and Stresses


Lecture 16 - Microdevice Suspensions: Lumped Modeling


Lecture 17 - Residual Stress and Stress Gradients


Lecture 18 - Torsion and Twist


Lecture 19 - Vibrations of Microsystems Devices: Part-1


Lecture 20 - Vibrations of Microsystems Devices: Part-2 Micromachined Gyroscopes: Part-1


Lecture 21 - Micromachined Gyroscopes: Part-2 Modelling of Coupled Electrostatic Microsystems: Part-1


Lecture 22 - Modelling of Coupled Electrostatic Microsystems: Part-2


Lecture 23 - Coupled Electrothermal-elastic Modelling


Lecture 24 - Modelling of Microsystems: Scaling Effects


Lecture 25 - Finite Element Method and Microsystems


Lecture 26 - Theoretical Basis for the Finite Element Method


Lecture 27 - Energy Theorems and Weak Form of the Governing Equation


Lecture 28 - Finite Element Equation Development and Shape Functions


Lecture 29 - Isoparametric FE Formulation and some Examples


Lecture 30 - Finite Element for Structures with Piezoelectric Materials


Lecture 31 - Semiconductor Device Physics


Lecture 32 - BJT and MOSFET Characteristics and Op-Amps


Lecture 33 - Op-Amp Circuits and Signal conditioning for Microsystems Devices


Lecture 34 - Control and Microsystems


Lecture 35 - Vibration Control of a Beam


Lecture 36 - Signal Conditioning Circuits and Integration of Microsystems and Microelectronics


Lecture 37 - Pressure Sensor Design Concepts, Processing, and Packaging: Part-1


Lecture 38 - Pressure Sensor Design Concepts, Processing, and Packaging: Part-2


Lecture 39 - Pressure Sensor Design Concepts, Processing, and Packaging: Part-3 Capacitive Micro-accelerometer: Part-1


Lecture 40 - Capacitive Micro-accelerometer: Part-2